FlexFrame Interconnect is a module-level interconnect technology that enables multi-component modules to be placed on printed circuit boards to act as an adapter to apply the same process as a standard leadframe package. FlexFrame Interconnect is available with a wide range of pin locations, pitches, and standoff heights. Flexibility is also enhanced by windows that enable components to be placed in the center of a module.
FlexFrame adapters utilize phosphor-bronze pins that are arrayed in a carrier and formed to emulate gullwing or J-leads. Carriers are constructed of laminates with coefficients of thermal expansion compatible with host PCBs.