Advanced Packaging

Microelectronics Assembly | Wirebonding | Encapsulation

Advanced Packaging Capabilities Ideal for High-Reliability Applications

Since 1993, ISI has been developing and producing complex, multi-component modules. Composed of bare or packaged die and passive electronics with thermoset epoxy overmolding. ISI’s molded multi-component modules are ideal for miniaturized applications subject to harsh environments.

Microelectronics Assembly

Assembly of bare die and components on various substrates/PCBs

Wirebonding

Latest generation equipment with capabilities including:

Encapsulation

Overmolding to ruggedize for harsh environments

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