IC Lifecycle Management

IC Obsolescence | Interposers | BGA Reballing

Experts in IC Obsolescence

ISI’s obsolescence solutions help our customers to circumvent IC obsolescence and parts shortages with the development of customized solutions that avoid the time and cost of re-spinning or re-designing PCBs.

ISI Lifecycle Solutions

IC Interposers & Adapters

ISI is a recognized industry leader and manufacturer of adapter products that convert single or multiple components to almost any IC footprint. We help customers through semiconductor shortages, outages and EoL issues.

BGA Reballing

Lead-free, packaged products create reliability and compatibility dilemmas for military, aerospace and high-reliability applications. ISI’s process of removing lead-free (RoHS) solder balls then attaching leaded Sn63Pb37 eutectic balls has been audited and approved for production by leading commercial, industrial, aerospace and defense companies.

Beyond equipment and process flow—great projects get done because we collaborate and engage at a deeper level than anyone else.

Case Studies

Our best success stories involve:

COLLABORATION Your engineering team working with ours as peers to solve a problem like shrinking a small board down to the size of a coin.

ENGAGEMENT Customers don't see us as just a contract manufacturer. Our value comes from our design engineering, like optimizing for cost or environmental conditions. Tap into our long history of successful projects by engaging with us early—and with your toughest challenges. We're ready!

End-to-End Microelectronic Development Expertise

Ultra-dense, SWaP-optimized microelectronic assemblies. 

Survive harsh environments;
Temperature cycle, shock, and vibration.

Integration of sensors with microelectronic modules.

Multi-component modules in standard IC form factor
(BGA, QFP, etc.).

Replace obsolete ICs with a form/fit/function equivalent module.

Contact ISI

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