Microelectronics Design & Manufacturing 2018-04-27T18:17:57+00:00


A proven process of ISI – we blend high density packaging with advanced interconnect to quickly deliver miniaturized solutions. Reduce your concept-to-production cycle times with our uniquely positioned US-based, one-stop-shop that contributes to a cost-effective solution which includes multi-discipline design teams and vertically integrated manufacturing.

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ISI works best when engaged with our customers at the early concept development stage. Together we explore multiple approaches to arrive at the best technical and commercial solution with a quick time-to-market.

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Design Capabilities

Microelectronics Design - System Level Engineering, PCB & Substrate Design, Mechanical / Physical Packaging, Interconnect Design
System Level Engineering
PCB & Substrate Design
PCB & Substrate
Custom Interconnect design services and solutions
Mechanical & physical packaging design
Mechanical & Physical Packaging

Manufacturing Capabilities

Bare die assembly
Bare Die Assembly
Advanced SMT - Surface Mount Technology
Advanced SMT
3D & Advanced Packaging / Atom + DDR3 Module
Connector Products

Microelectronics Solutions

Integrated Solutions in Microelectronics Technology
Integrated Solutions
3D & Advanced Packaging
3D & Advanced Packaging
FPGA Computing Systems
FPGA Computing Systems
Modules & Adapters
Modules & Adapters
3D & Advanced Packaging / Atom + DDR3 Module
Connector Technologies
IC Obsolescence & Reballing Solutions
IC Obsolescence & Reballing

Contact ISI with your Microelectronics needs