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Resources 2017-07-11T21:43:30+00:00

Glossary of Terms

Below is a glossary of commonly used terms in the Microelectronics and Packaging Industry. 

ADC 2017-03-23T19:47:56+00:00

ADC / Analog-to-Digital Converter

In electronics, an analog-to-digital converter (ADC, A/D, A–D, or A-to-D) is a system that converts an analog signal into a digital signal. A digital-to-analog converter (DAC) performs the reverse function.

An ADC may also provide an isolated measurement such as an electronic device that converts an input analog voltage or current to a digital number proportional to the magnitude of the voltage or current. Typically the digital output will be a two’s complement binary number that is proportional to the input, but there are other possibilities.

There are several ADC architectures. Due to the complexity and the need for precisely matched components, all but the most specialized ADCs are implemented as integrated circuits (ICs).

AOI 2017-03-23T19:48:02+00:00

AOI / Automated Optical Inspection – is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).

ASEP 2017-03-23T19:48:10+00:00

ASEP / Application Specific Electronics Packaging

ASIC 2017-03-23T19:48:15+00:00

ASIC / Application-Specific Integrated Circuit – is an integrated circuit (IC) customized for a particular use, rather than intended for general-purpose use. For example, a chip designed to run in a digital voice recorder or a high-efficiency Bitcoin miner is an ASIC. Application-specific standard products (ASSPs) are intermediate between ASICs and industry standard integrated circuits.

BGA 2017-03-23T19:48:23+00:00

BGA / Ball Grid Array

See also, BGA Reballing

Component 2017-03-23T19:48:29+00:00

Component

 

CTE 2017-03-23T19:48:35+00:00

CTE / Co-Efficient Thermal Expansion – When materials are heated, their size and volume increase in small increments, in a phenomenon known as thermal expansion. Expansion values vary depending on the material being heated. The coefficient ratio of thermal expansion indicates how much a material expands per 1 oC (2.2 oF) rise in temperature.

 

DAC 2017-03-23T19:48:40+00:00

DAC / Digital-to-Analog Converter

 

DFM 2017-03-23T19:48:48+00:00

DFM / Design for Manufacture

 

DFR 2017-03-23T19:48:54+00:00

DFR / Design for Reliability

 

DFT 2017-03-23T19:49:00+00:00

DFT / Design for Test

 

Die Stacking 2017-03-23T19:49:05+00:00

Die Stacking

 

DIP 2017-03-23T19:49:11+00:00

DIP – Dual In-line Package

Fan-Out 2017-03-23T19:49:16+00:00

Fan-Out – In digital electronics, the fan-out of a logic gate output is the number of gate inputs.

 

 

Flexible Electronics 2017-03-23T19:49:22+00:00

Flexible Electronics – Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic.

 

 

FlexFrame™ 2017-03-23T19:49:28+00:00

FlexFrame

 

Flip Chip 2017-03-23T19:49:33+00:00

Flip Chip

 

FPGA 2017-03-23T19:49:40+00:00

FPGA – Field Programmable Gate Array

 

HiLo™ 2017-03-23T19:49:47+00:00

HiLo

 

IC Obsolescence 2017-03-23T19:49:53+00:00

IC Obsolescence

 

IC Package 2017-03-23T19:49:58+00:00

IC Package

 

Interposer 2017-03-23T19:50:07+00:00

Interposer

 

ITAR 2017-03-23T19:50:12+00:00

ITAR / International Traffic in Arms Regulations

 

Leadframe 2017-03-23T19:50:17+00:00

Leadframe

 

LGA 2017-03-23T19:50:24+00:00

LGA / Land Grid Array

 

Microelectronics 2017-03-23T19:50:29+00:00

Microelectronics

 

MID 2017-03-23T19:50:35+00:00

MID / Molded Interconnect Device

 

Mixed Assembly 2017-03-23T19:50:40+00:00

Mixed Assembly

 

MMCM 2017-03-23T19:50:45+00:00

MCMM / Multi-Component Memory Module

 

Module 2017-03-23T19:50:50+00:00

Module

 

NRE 2017-03-23T19:50:59+00:00

NRE / Non Reoccurring Engineering – is a one time engineering effort by a vendor that is paid for by a customer. NRE is driven by a feature or capability that a product lacks and a customer wants enough to pay for.

 

Overmold 2017-03-23T19:51:05+00:00

Overmold

PGA 2017-03-23T19:51:10+00:00

PGA / Pin Grid Array

 

Pitch 2017-03-23T19:51:15+00:00

Pitch

 

PPGA 2017-03-23T19:51:21+00:00

PPGA / Plastic Pin Grid Array

 

QFP 2017-03-23T19:51:26+00:00

QFP / Quad Flat Package

 

Reballing 2017-03-23T19:51:31+00:00

Reballing – A reflow heats up the solder in order to get it malleable enough to reform a broken connection, but the resulting connection still isn’t as strong as it was originally. A reball means that someone completely removes the old solder from the motherboard and chip and reattaches the chip with new solder balls.

 

Respin 2017-03-23T19:51:36+00:00

Respin

RoHS 2017-03-23T19:51:43+00:00

RoHS / Restriction of Hazardous Substances Directive – The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.

  • RoHS is often referred to (inaccurately) as the ‘lead-free directive’, but it restricts the use of the following ten substances:
  1. Lead (Pb)
  2. Mercury (Hg)
  3. Cadmium (Cd)
  4. Hexavalent chromium (Cr6+)
  5. Polybrominated biphenyls (PBB)
  6. Polybrominated diphenyl ether (PBDE)
  7. Bis(2-ethylhexyl) phthalate (DEHP)
  8. Butyl benzyl phthalate (BBP)
  9. Dibutyl phthalate (DBP)
  10. Diisobutyl phthalate (DIBP)
Ruggedize 2017-03-23T19:51:47+00:00

To ruggedize electronics is to add a level of protection for electronic components to ensure shock and vibration do not cause failure. Electronics overmolding is a specialty of ISI, which is the application of thermoset encapsulation, which is an epoxy overmold process which uses tooling to form a protective barrier around an electronic part.

 

Semiconductor 2017-03-23T19:51:53+00:00

Semiconductor

SiP 2017-03-23T19:51:58+00:00

SiP – System in Package

Socket 2017-03-23T19:52:10+00:00

Socket

SOIC 2017-03-23T19:52:15+00:00

SOIC

SOJ 2017-03-23T19:52:20+00:00

SOJ

SMT 2017-03-23T19:52:26+00:00

SMT – Surface Mount Technology

Substrate 2017-03-23T19:52:58+00:00

Substrate

TSOP 2017-03-23T19:52:46+00:00

TSOP

Underfill 2017-03-23T19:52:52+00:00

Underfill

Wafer Dicing 2017-03-23T19:53:03+00:00

Wafer Dicing

Wave Soldering 2017-03-23T19:53:11+00:00

Wave Soldering – Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave.

Wirebond 2017-03-23T19:53:16+00:00

Wirebond – 

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