Increase the lifespan and reliability of electronic components and modules by ruggedizing with encapsulation. Ruggedization protects products from thermal stresses, shock and vibration common in harsh environment applications. Ruggedized electronic modules are ideal for high-reliability applications across a range of industries: aerospace, military, automotive, industrial, and mobile devices.
| Material | Tmax (C°) | X-Y CTE (ppm) | Thermal Conductivity (W m-1 K-1) | Electrical Conductivity (106 S m-1) | Dk | Df |
|---|---|---|---|---|---|---|
| FR-4 | 125 | 10-14 | 0.3-0.9 | < 1E – 20 | 3.9 – 4.5 | 0.02 |
| BT – Epoxy | 210 | 10-14 | 0.7 | < 1E – 13 | 3.6 – 3.7 | 0.01 |
| Polyimide | 250 | 6-9 | 0.7 | <5E – 20 | 3.6 | 0.002 |
| ABF | 150 | 20-40 | 0.15 | unknown | 3.2 – 3.4 | 0.004 – 0.02 |
| Silicon | 2500 | 2.6 | 130 | 1 – 100 | 11.7 | 0.0005 – 5 |
| Borosilicate Glass | 755 | 3.2 | 1.1 | 1E – 8 | 4.1 | 0.004 |
| Copper | 2000 | 16 | 400 | 59 | – | – |
| Gold | 1100 | 14 | 310 | 41 | – | – |
| Silver | 960 | 20 | 429 | 63 | – | – |
| Nickel | 1500 | 13 | 97 | 14 | – | – |
| SN63/Pb37 | 170 | 25 | 40 | 7 | – | – |
| SAC3005 | 210 | 24 | 58 | 9 | – | – |
| Sn10Pb90 | 260 | 28 | 36 | 5 | – | – |
Custom tooling is designed and fabricated in house. ISI has a complete tool & die shop with decades of mold tooling fabrication expertise.
Ultra-dense, SWaP-optimized microelectronic assemblies.
Survive harsh environments;
Temperature cycle, shock, and vibration.
Integration of sensors with microelectronic modules.
Multi-component modules in standard IC form factor
(BGA, QFP, etc.).
Replace obsolete ICs with a form/fit/function equivalent module.
