Ruggedized Modules

Protect Against Harsh Environments, Shock, and Vibration

High-Reliability, Overmolded Microelectronic Modules

Increase the lifespan and reliability of electronic components and modules by ruggedizing with encapsulation. Ruggedization protects products from thermal stresses, shock and vibration common in harsh environment applications. Ruggedized electronic modules are ideal for high-reliability applications across a range of industries: aerospace, military, automotive, industrial, and mobile devices.

Why Specify an Overmolded Module?

Commercial packaged components
Multi-chip modules
Microelectronics and bare die assemblies

Chemical
Moisture
Thermal shock

Bare die and wire bonds
Improved solder bump integrity
Mechanical Shock

Microelectronic Ruggedization Components and Features

Molding Benefits

Circuit protection: physical, chemical, thermal
Ruggedization – stress distribution
Thin package warpage control
Improved HAST performance

Substrates

IC Substrate (flatness, fine line/space, fine pad pitch, embedded passive films)
PCB (inexpensive, moderate interconnect density)
Copper leadframe
Other: ceramic, glass, and silicon

Epoxy Mold Compound (EMC)

EMC Properties

Tunable CTE: 7-20 ppm (T<Tg), 20-70 ppm (T>Tg)
CTE ~10 ppm typical
Tg ~ 150 typical

EMC Composition

Silica is typical
Improved thermal conductivity
Improved CTE
Filler content: variable, typically >80%

EMC Material Properties

Material	Tmax (C°)	X-Y CTE (ppm)	Thermal Conductivity (W m^-1 K^-1)	Electrical Conductivity (10⁶ S m^-1)	Dk	Df
FR-4	125	10-14	0.3-0.9	< 1E – 20	3.9 – 4.5	0.02
BT – Epoxy	210	10-14	0.7	< 1E – 13	3.6 – 3.7	0.01
Polyimide	250	6-9	0.7	<5E – 20	3.6	0.002
ABF	150	20-40	0.15	unknown	3.2 – 3.4	0.004 – 0.02
Silicon	2500	2.6	130	1 – 100	11.7	0.0005 – 5
Borosilicate Glass	755	3.2	1.1	1E – 8	4.1	0.004
Copper	2000	16	400	59	–	–
Gold	1100	14	310	41	–	–
Silver	960	20	429	63	–	–
Nickel	1500	13	97	14	–	–
SN63/Pb37	170	25	40	7	–	–
SAC3005	210	24	58	9	–	–
Sn10Pb90	260	28	36	5	–	–