HiLo Interconnect allows for quick, solder-free removal and replacement of BGA components and modules
Our revolutionary HiLo connector system uses standard PCB materials and processes to create a connector with a pin-out optimized for your system.
HiLo and custom board-to-board interconnect products are commonly used in military, aerospace and high-reliability applications, and also compete well in cost-driven applications.
HiLo consists of 2 contacts:
A pin (male) and socket (female)
HiLo uses a standard, high-volume production process to make custom product variants
For large area array connectors, a CTE mismatch between the connector and PCB materials can result in significant stresses and failures under thermal cycling applications. HiLo minimizes these CTE mismatch stresses by utilizing a laminate with a CTE similar to the customer’s PCB.
Drilled laminate connectors also exhibit less warp and twist during reflow compared to molded connectors. ISI’s HiLo designs have a tendency to conform to the substrate material during reflow resulting in high quality, reliable solder joints.
|3.9 – 4.5
|High Temp Epoxy
|3.6 – 3.7