BGA Reballing

BGA Reballing 2017-02-01T00:42:11+00:00

Most semiconductor suppliers have converted to lead-free packaging creating reliability and compatibility dilemmas for military, aerospace and Hi-Rel applications. ISI’s process of BGA reballing involves the removal of lead-free (RoHS) solder balls then attaching leaded Sn63Pb37 and other special solder ball alloys. This process has been audited and approved for production by several Tier 1 defense suppliers. Download reballing overview

BGA Reballing by Interconnect Systems, Inc.

ISI’s 10-Step Certified Reballing Conversion Process

  • Step: 1 – Incoming inspection procedures per Quality Assurance Procedures (QAP)
  • Step: 2 – Moisture Sensitivity Level (MSL) requirements are observed and followed
  • Step: 3 – Deballing process is specified based on the component
  • Step: 4 – Reballing utilizes high accuracy assembly tooling for ball placement
  • Step: 5 – Reflow solder profiles customized for each component
  • Step: 6 – Post ball attach cleaning procedures are monitored and measured using an Ionograph
  • Step: 7 – Part marking available per customer specifications on request
  • Step: 8 – True position, co-planarity and flatness are measured using Nikon Nexis or RVSI model LS6000
  • Step: 9 – Final inspection per QAP – Quality Assurance Plans
  • Step: 10 – Packaging: either customer supplied, JEDEC trays or tape and reel per EIA-481 with nitrogen purged dry pack bags

BGA ReballingRoHS Solder Compatibility Interposers

Other types of RoHS solder compatibility issues that involve BGA reballing process arise when RoHS compliant and non-RoHS compliant components need to be attached to the same host board. This issue of using different solders on the same board can be addressed by placing BGA interposers in between the BGA component and the host board.

  • The component with the dissimilar type of solder alloy is soldered to the top of the interposer.
  • Solder balls on the bottom of the interposer use the same alloy as is common for other components on the host board, eliminating the use of two different types of solders in the same solder joint.

Most semiconductor suppliers have converted to lead-free packaging creating reliability and compatibility dilemmas for military, aerospace and Hi-Rel applications. ISI’s process of BGA reballing involves the removal of lead-free (RoHS) solder spheres then attaching leaded Sn63Pb37 eutectic spheres, has been audited and approved for production by several Tier 1 defense suppliers.

  • ISI BGA reballing process is designed and optimized to minimize stress on the IC
  • 100% automated optical assembly of reballing components
  • ISI has completed the BGA reballing process of over 1,000,000 components
  • Any pitch, any package, any quantity of BGA reballing can be accomplished
  • Fast turn-around conversion of any alloy to any alloy including Pb-free to Sn/Pb BGA reballing methods necessary
  • Get a BGA reballing quote in less than 24 hours

Certified Reballing Conversion Process

  • 100% automated optical inspection for true position, flatness and co-planarity
  • All processes in accordance with IPC/JEDEC J-STD sensitivity levels
  • The component temperature exposure is minimized during the ball removal process
  • All parts are reballed using a custom temperature profile in a nitrogen environment

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