3D & Advanced Packaging 2017-08-18T19:54:29+00:00

3D & Advanced Packaging is now within reach

Begin your next project with ISI to utilize our Next Level Integration process, which blends high-density packaging with advanced interconnect to quickly deliver miniaturized solutions.

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3D & Advanced Packaging Examples

SiP – System in Package

Integrate processor, memory and more into your next high-density package.

What’s inside:

  • 22x22mm module
  • 4 die stack:
    • Processor
    • DDR
    • Flash
  • ADC
  • VR die & passives
  • HiLo connector for stacking

High-Density 3D & Advanced Packaging Example

3D & Advanced Package with protective encapsulation
SiP - System in Package Microelectronics

SiP / System in Package

ISI works closely with customers to bring all necessary features of 3D & advanced packaging into a design that is high-density and survives harsh environments.

What’s inside:

  • 45x45mm BGA
  • 2 Flip Chip Die
  • 3 Wire Bond Die
  • 2 Packaged ICs
  • Multiple Passives

3D & Advanced Packaging Example - Protect electronics with heat spreader

SiP w/1,720-Pin BGA

Integrate processor, memory and more into your next high-density package.

What’s inside:

  • 40x45mm BGA
  • (1) Intel Atom Processor
  • (9) SDRAM DDR3L x8 (x72 bank)
  • 1,720-pin BGA (1mm pitch)
  • Integrated Heat Sink
  • Overmolded for High Reliability applications

3D & Advanced Packaging Example - Protect electronics with over molding and heat spreader

Atom + DDR3 Module - Microelectronics Packaging
Micro FPGA Compute Node

Micro FPGA Compute Node

ISI can assist in the most challenging of situations to provide a solution that best fits your needs

What’s inside:

  • Flip Chip FPGA Die
  • (2) Multi-Die DDR3 packages
  • Power management
  • Card Edge Interface

Micro FPGA Compute Node Size Comparison

FC512 Configurator

9-die FPGA configurator package

What’s inside:

  • 13x13mm body size
  • 9 die module
  • 224 balls
  • 0.8mm pitch

FC512 Configurator - scale comparison

FC512 Configurator
Chip on Flex

Chip on Flex

Custom designed to suit your needs

What’s inside:

  • 3 wire bond die
  • Passives
  • Embedded in smart credit card

Chip on Flex - scale comparison

High Density Memory Module

ISI works closely with customers to bring all necessary features of 3D & advanced packaging into a design that is high-density and survives harsh environments.

What’s inside:

  • 5 DDR3 Die
  • Long wirebonds to reach center-of-die pads

High Density Memory Module - size comparison

High Density Memory Module

Enabling Technologies

3D Stacked Die Stacking

Fig. 2 Multiple same die stacked with spacers

Thermoset Overmolding

Thermoset Overmolding - Electronics protection method

3D Substrate Stacking

Fig 1. Substrate stacking using bare-dieFig 2. Stacked substrates using packaged devices

 

Microelectronics Design & Manufacturing

Explore the possibilities of Microelectronics with ISI. We will guide you through the process.

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