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Solutions 2017-07-11T21:27:38+00:00

ISI pioneered the concept of Next Level Integration an alternative design path to integrate at the module level rather than the silicon level, resulting in lower production costs and faster time-to-market. Our in-depth design and process development knowledge and extensive manufacturing capabilities allow us to quickly execute on complex projects, which results in a comprehensive turnkey solution for our customers.

Integrated Solutions in Microelectronics Technology
Integrated Solutions
3D & Advanced Packaging
3D & Advanced Packaging
FPGA Computing Systems
FPGA Computing Systems
3D & Advanced Packaging / Atom + DDR3 Module
Modules & Adapters
3D & Advanced Packaging / Atom + DDR3 Module
Connector Technologies
IC Obsolescence & RoHS Solutions
IC Obsolescence & Reballing

Contact ISI with your Microelectronics needs

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