Bare Die Assembly

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Bare Die Assembly Equipment:

Dedicated Clean Room
State-of-the-art bare die assembly / placement machine
Placement accuracy of ± 10µm
Mixed assembly (SMT + Bare Die)
Stacked die assembly
Latest generation wire bonding equipment
Bonding capabilities include: gold ball, gold and aluminum wedge, ribbon and deep reach
Flip chip
Underfill
Wafer dicing
Conduction/convection wafer reflow oven
Precision automated capillary underfill
Molded underfill via transfer molding

Related Topics:
Wirebonding
Advanced SMT
3D & Advanced Packaging