ISI Showcases Advanced 3D Packaging Products at IMAPS 2014

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ISI Showcases Advanced 3D Packaging Products at IMAPS 2014

CAMARILLO, CALIF. – October 9, 2014 – ISI (www.isipkg.com), a leading provider of advanced packaging and interconnect technologies, today announced it will showcase its latest advanced/3D packaging and high-density interconnect products at IMAPS 47th International Symposium on Microelectronics being held October 13-16, 2014 at Town and Country Resort and Conference Center, San Diego, CA.

Visitors to IMAPS 2014 can learn more about ISI’s design and manufacturing capabilities at Booth 401.

2017-02-10T18:55:44+00:00