Capabilities

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Capabilities 2017-02-22T22:55:31+00:00

ISI’s uncommonly broad design and production microelectronics capabilities allow quick creation of innovative solutions that would otherwise require multiple suppliers. Since 1987, ISI has continuously improved its capabilities and experience by adding engineering talent, investing in manufacturing assets, and by completing strategic acquisitions.

Microelectronics Design - System Level Engineering, PCB & Substrate Design, Mechanical / Physical Packaging, Interconnect Design
Design
Bare Die Assembly - ISO 9001:2008 quality management, wire bonding, flip chip, underfill, wafter dicing and more
Bare Die Assembly
Advanced SMT - State-of-the-art Surface Mount Technology
Advanced SMT
Electronics Overmolding - Electronics protection against shock and vibe
Electronics Overmolding
Testing & inspection - wide variety of electronic test equipment and capabilities
Testing & Inspection
3D & Advanced Packaging / Atom + DDR3 Module
Connector Products

Contact ISI with your Microelectronics needs

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ISI's capabilities in microelectronics design and manufacturing bring new possibilities