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Molex Acquires Interconnect Systems, Inc.

According to Tim Ruff, senior vice president, Molex, the acquisition enables Molex to offer a wider range of fully integrated solutions to customers worldwide. “We are excited about the unique capabilities and technologies the ISI team brings to Molex. ISI’s proven expertise in high-density chip packaging strengthens our platform for growth in existing markets and [...]

By | 2017-02-15T15:20:13+00:00 April 7th, 2016|News|0 Comments

ISI Showcases Advanced 3D Packaging Products at IMAPS 2014

CAMARILLO, CALIF. – October 9, 2014 – ISI (www.isipkg.com), a leading provider of advanced packaging and interconnect technologies, today announced it will showcase its latest advanced/3D packaging and high-density interconnect products at IMAPS 47th International Symposium on Microelectronics being held October 13-16, 2014 at Town and Country Resort and Conference Center, San Diego, CA. Visitors [...]

By | 2017-02-10T18:55:44+00:00 October 9th, 2014|News|0 Comments

ISI Launches Next Generation FPGA Configurator Device for Altera Stratix V and Arria 10 FPGAs

FC512 Saves 75% Board Space and Simplifies System Design CAMARILLO, CALIF. – March 24, 2014 – Interconnect Systems Inc. (ISI), a leading provider of advanced packaging and interconnect solutions, today announced availability of its latest generation FC512 FPGA Configurator designed and tested to be used with Altera Stratix V and Arria 10 FPGAs. The FC512 [...]

By | 2017-02-28T17:21:48+00:00 March 24th, 2014|News|0 Comments

FPGA Configurator Provides Miniaturized, High Speed Configuration Solution for Altera FPGAs

FC512 integrates CPLD and 512Mb Flash into 13x13mm BGA package Interconnect Systems Inc. (ISI), a leading provider of Next Level Integration solutions, today announced availability of the FC512 FPGA Configurator. As FPGAs continue to increase in size and capabilities, their configuration file size also increases, so new approaches are needed to meet system on and [...]

By | 2017-02-10T18:56:10+00:00 February 6th, 2013|News|0 Comments

ISI Delivers Molded Multi-Component Modules for Miniaturized, Rugged Applications

New MMCM Product Line Improves Cost and Reliability for Custom Applications CAMARILLO, CALIF. – Interconnect Systems Inc. (ISI), a leading provider of advanced electronics packaging and interconnect technologies, announced today the availability of molded multi-component modules (MMCM) designed for applications in rugged, miniaturized environments. The new MMCM product line improves cost and reliability for custom [...]

By | 2017-02-10T18:56:23+00:00 July 31st, 2012|News|0 Comments

ISI Establishes Near Sensor Computing Business Unit to Deliver Miniaturized FPGA Processing Solutions

Latest generation FPGAs Decrease Size, Cost, Latencies, and Power Consumption Across System CAMARILLO, CALIF. – Interconnect Systems Inc. (ISI), a leading provider of advanced packaging and interconnect technologies, announced today that it has established a new business unit for Near Sensor Computing. Near Sensor Computing blends ISI’s advanced packaging expertise with FPGA system design to [...]

By | 2017-02-10T18:56:40+00:00 May 15th, 2012|News|0 Comments

ISI and Nallatech Achieve Certified Tier Membership of the Xilinx Alliance Program

CAMARILLO, CALIF. – ISI, a leading provider of advanced packaging and interconnect technologies, today announced the company and its subsidiary, Nallatech, are officially certified tier members of the Xilinx Alliance Program. ISI and Nallatech passed the rigorous corporate audit and its engineers successfully completed the certification process, allowing the company to achieve certified member status. [...]

By | 2017-02-10T18:56:54+00:00 April 3rd, 2012|News|0 Comments

ISI Now Certifies Reballed Parts and Offers Automated Optical Inspection

Most Semiconductor suppliers have converted to lead free packaging creating compatibility and reliability dilemmas for Military, Aerospace and Hi-Rel applications. ISI’s process of removing lead-free (RoHS) solder spheres then attaching leaded Sn63Pb37 eutectic spheres, has been qualified by leading Commercial, Industrial, Military and Aerospace companies. ISI has advanced their reballing process to the extent they [...]

By | 2017-02-10T18:57:03+00:00 August 19th, 2009|News|0 Comments

ISI FlexFrame™ Adapters Offer Low Cost IC Obsolescence Solutions

IC obsolescence issues are becoming an increasing burden for manufactures with long product life cycles. Today, many of the ICs going obsolete are in SMT gullwing and j-lead packages such as QFPs, PLCCs, TSOPs, and SOICs. ISI has developed a new interconnect system, FlexFrame™ to enable footprint conversion adapters that replace this family of packages. [...]

By | 2017-02-10T18:57:15+00:00 June 6th, 2008|News|0 Comments

ISI Boasts 72-Hour Turn-Around for PC104 Board-to-Board Interconnect

(Camarillo, CA) – Interconnect Systems, Inc. responds to increasing demand for PC104 & PC104 Plus Press Fit board-to-board interconnect with higher inventories and a 72-hour turn-around time. Due to RoHS many manufacturers are making the switch from Solder Tail to Press Fit connectors creating more inquiries for a dependable, cost effective source for Press Fit [...]

By | 2017-02-10T18:57:25+00:00 July 23rd, 2007|News|0 Comments