About ISI

Home/About ISI
About ISI 2017-10-04T15:06:40+00:00

New Possibilities

As of April, 2016, ISI and our subsidiary companies are now part of the Molex family. This new relationship has brought extra value, as well as opened new avenues of innovation, value and customer fulfillment to us all. With the innovation of ISI and the global reach of Molex, together we can make greater progress in integrated solutions in any volume, market or location on the planet.

Molex - one company > a world of innovation
Innovative Integration
Nallatech - Leaders in FPGA Computing
ISI - Interconnect Systems

ISI’s Focus

  • Successful co-development of new technology:  We work best when engaged with our customers at the early concept development stage.  Together we explore multiple approaches to arrive at the best technical and commercial solution with a quick time-to-market.
  • Continuously adding capabilities:  ISI offers a broad range of capabilities that are rare to find in one organization:  A talented Engineering staff with comprehensive design disciplines, a broad range of capital manufacturing equipment, and a willingness to develop new manufacturing processes.  We are continuously adding to our capabilities, allowing us to develop and deliver solutions that would typically require managing multiple suppliers.
  • Quick time-to-market:  ISI offers customers a way to develop innovative solutions while maintaining or improving their typical product development cycle.

History of Success in Delivering Technology

Since 1987, ISI has delivered advanced packaging and interconnect solutions for top-tier OEMs in a wide range of industries including military, aerospace, data storage and networking, telecom, commercial, supercomputer, medical and industrial. For over two decades, our solutions have been designed in business-critical and mission-critical applications such as avionics, medical imaging, night vision, industrial inspection, unmanned aerial vehicles (UAVs), helmet cameras, surveillance equipment, networking equipment, and more.

Milestones:

Year Description
2016
  • ISI and all subsidiaries acquired by Molex.
2010
  • Strengthened FPGA products and engineering resources by acquiring Innovative Integration, a leading supplier of data acquisition and signal processing solutions.
2009
  • Developed first Near Sensor Computing product.
  • Received ISO 9001: 2008 Certification upgrade for two manufacturing facilities in Camarillo, CA.
2008
  • ISI acquires Hestia Technologies of Santa Clara, CA, bringing more than 25 years experience in semiconductor packaging. The acquisition added several new technologies, along with a focus on high-density, 3D memory packaging.
  • ISI receives ITAR registration from the United States Department of State.
  • Acquired Nallatech, of Cumbernauld, Scotland, an established leader in FPGA Acceleration in the High Performance Computing market.
2007
  • Designed and manufactured FSB – FPGA Acceleration Modules.
2005
  • Added connector design resources, tool room, molding and equipment automation capabilities through acquisition of Comm Con Connectors, Inc.
2002
  • Refocused our strategy to meet the emerging market for Next Level Integration.
2001
  • Acquired Emulation Technology (ET) of Santa Clara, CA, a leader in the adapter and test accessory market. Emulation Technology has one of the broadest product offerings providing well over 4,000 interconnect products to design and development engineers.
2000
  • Received ISO 9001:2000 Certification for manufacturing facilities in Camarillo, CA.
  • Designed and tooled initial socket contact for HiLo™ Flexible Interconnect System.
  • Began in-house bare die assembly and flex circuit assembly capabilities.
1999
  • Ranked No.58 on Inc. 500 Magazine’s list of America’s fastest-growing privately held companies.
1997
  • Selected by IBM/Motorola/Apple to build PowerPC modules for Apple G3 computers. Ramped production from 250 parts per day to 10,000 parts per day in a four month period. Manufactured over 4 million PowerPC modules through program life.
1993
  • Awarded patent for surface mounting pins to a substrate.
1992
  • Designed and manufactured 557 I/O PPGA for GaAs die used in supercomputer, telecom equipment, and semiconductor test applications.
1987
  • Company founded to design, manufacture and market high-pin count PPGAs.

Contact ISI with your Microelectronics needs

CONTACT ISI