K & S Wirebonder

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K & S Wirebonder 2017-02-02T15:22:11+00:00

Project Description

Wirebonding process – precision bare die attachment.

Wire bonding IC and semiconductor packaging to PCB with gold or copper connections. Multi-layer arrays at variable lengths are available.

Related Topics:
Wirebonding
Advanced SMT
3D & Advanced Packaging

Project Details

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