Microelectronics Design & Manufacturing 2017-02-14T23:54:06+00:00

NEXT LEVEL INTEGRATION

A proven process of ISI – we blend high density packaging with advanced interconnect to quickly deliver miniaturized solutions. Reduce your concept-to-production cycle times with our uniquely positioned US-based, one-stop-shop that contributes to a cost-effective solution which includes multi-discipline design teams and vertically integrated manufacturing.

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ENGAGING
WITH ISI

ISI works best when engaged with our customers at the early concept development stage. Together we explore multiple approaches to arrive at the best technical and commercial solution with a quick time-to-market.

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Design Capabilities

Microelectronics Design - System Level Engineering, PCB & Substrate Design, Mechanical / Physical Packaging, Interconnect Design
System Level Engineering
PCB & Substrate Design
PCB & Substrate
Custom Interconnect design services and solutions
Interconnect
Mechanical & physical packaging design
Mechanical & Physical Packaging

Manufacturing Capabilities

Bare die assembly
Bare Die Assembly
Advanced SMT - Surface Mount Technology
Advanced SMT
3D & Advanced Packaging / Atom + DDR3 Module
Connector Products

Microelectronics Solutions

Integrated Solutions in Microelectronics Technology
Integrated Solutions
3D & Advanced Packaging
3D & Advanced Packaging
FPGA Computing Systems
FPGA Computing Systems
Modules & Adapters
Modules & Adapters
3D & Advanced Packaging / Atom + DDR3 Module
Connector Technologies
IC Obsolescence & Reballing Solutions
IC Obsolescence & Reballing

Contact ISI with your Microelectronics needs

CONTACT ISI