Microelectronics Design & Manufacturing Tom Robinson 2017-03-29T23:02:08+00:00

NEXT LEVEL INTEGRATION

A proven process of ISI – we blend high density packaging with advanced interconnect to quickly deliver miniaturized solutions. Reduce your concept-to-production cycle times with our uniquely positioned US-based, one-stop-shop that contributes to a cost-effective solution which includes multi-discipline design teams and vertically integrated manufacturing.

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ENGAGING
WITH ISI

ISI works best when engaged with our customers at the early concept development stage. Together we explore multiple approaches to arrive at the best technical and commercial solution with a quick time-to-market.

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Design Capabilities

Microelectronics Design - System Level Engineering, PCB & Substrate Design, Mechanical / Physical Packaging, Interconnect Design

System Level Engineering

PCB & Substrate Design

PCB & Substrate

Custom Interconnect design services and solutions

Mechanical & physical packaging design

Mechanical & Physical Packaging

Manufacturing Capabilities

Bare die assembly

Bare Die Assembly

Advanced SMT - Surface Mount Technology

3D & Advanced Packaging / Atom + DDR3 Module

Connector Products

Microelectronics Solutions

Integrated Solutions in Microelectronics Technology

Integrated Solutions

3D & Advanced Packaging

3D & Advanced Packaging

FPGA Computing Systems

FPGA Computing Systems

Modules & Adapters

Modules & Adapters

3D & Advanced Packaging / Atom + DDR3 Module

Connector Technologies

IC Obsolescence & Reballing Solutions

IC Obsolescence & Reballing

Contact ISI with your Microelectronics needs