A proven process of ISI – we blend high density packaging with advanced interconnect to quickly deliver miniaturized solutions. Reduce your concept-to-production cycle times with our uniquely positioned US-based, one-stop-shop that contributes to a cost-effective solution which includes multi-discipline design teams and vertically integrated manufacturing.
Microelectronics Design & Manufacturing Tom Robinson 2018-03-05T18:41:16+00:00 